| 摘要 |
An industrial apparatus for the electrolytic deposition of copper is disclosed, together with a process for using the apparatus. A plurality of deposition tanks are provided, each to retain an electrolyte and having at least one anode and at least one cathode positioned within the electrolyte when in use. A direct current power supply provides electrical power to the tanks, which are connected in series, so as to drive the electrolytic copper deposition process. A potential difference monitoring system monitors the respective electrical potential differences across the tanks and a controller modulates the electrical output of the direct current power supply in dependence upon the potential difference monitoring system. Optionally, tanks can be removed selectively from the circuit. Ideally the potential difference between the respective anode and cathode lies within the plateau region for electrolytic copper deposition. Signals and potential adjustments may be executed, if the electrical potential difference between two points is substantially higher or lower than other respective locations. |
