发明名称 Semiconductor substrate and method for manufacturing the same
摘要 Provided is a semiconductor substrate and a method for manufacturing the same. The semiconductor substrate includes a substrate, a discontinuously formed hemispheric metal layer on the substrate, and a semiconductor layer on the hemispheric metal layer. A plurality of voids on the interface of the substrate and discontinuous hemisphere are formed to absorb or relax the stain of interface. Accordingly, even if a subsequent layer is relatively thickly formed on the substrate, substrate bow or warpage can be minimized.
申请公布号 US8729670(B2) 申请公布日期 2014.05.20
申请号 US20090935978 申请日期 2009.04.15
申请人 LEE HAE YONG;CHOI YOUNG JUN;KIM JUNG GYU;LUMIGNTECH CO., LTD. 发明人 LEE HAE YONG;CHOI YOUNG JUN;KIM JUNG GYU
分类号 H01L21/20;H01L29/20;H01L33/00;H01L33/12 主分类号 H01L21/20
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