发明名称 |
Electronic device and method of radiating heat from electronic device |
摘要 |
An electronic device including a housing including a frame member exposed to an outer surface of the electronic device; a circuit substrate disposed within the housing on which a plurality of electronic components are disposed; and a heat-radiating member provided in contact with or in close proximity to the electronic components disposed on the circuit substrate, and in contact with the frame member. |
申请公布号 |
US8730675(B2) |
申请公布日期 |
2014.05.20 |
申请号 |
US201213404546 |
申请日期 |
2012.02.24 |
申请人 |
SANO TATSUYA;OKUCHI TETSUYA;SONY CORPORATION;SONY MOBILE COMMUNICATIONS AB |
发明人 |
SANO TATSUYA;OKUCHI TETSUYA |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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