| 摘要 |
The present invention relates to a fabrication method of multilayer films, including (a) a step of forming a layer of first particles by electrodeposition of dispersion, suspension or solution of first particles onto a conductive substrate in the presence of an electric field; and (b) a step of forming a layer of second particles by electrodeposition of dispersion, suspension or solution of second particles onto a layer of the first particles in the presence of an electric field, which forms a multilayer film having a variety of barrier characteristics on a conductive substrate through an electrodeposition process which can be applied to a large area, facilitate processes, and be conducted at low costs, and fabricates a barrier film with maximized barrier characteristics for moisture, oxygen and electric field by increasing the number of layers within the formed multilayer film using a vacuum forming process. The barrier films fabricated according to the fabrication method of the present invention show a uniform and good film quality, and can be improved to be suited to each of the characteristics such as heat resistance, moisture barrier properties, gas barrier properties, magnetic field barrier properties, etc. The present invention also relates to multilayer films fabricated according to the above fabrication method and gas barrier films using the same. |
