发明名称 Ultra high-speed wet etching apparatus
摘要 There is provided with an etching method using an etching apparatus. Four arms can be positioned in a direction substantially from a center of the stage toward a peripheral portion with an angle difference of about 90°. Etchant is supplied to a first position nearest to the center of the object which is rotating, from a first etchant supply nozzle placed on a first arm. Etchant is further supplied to a second position second nearest to the center of the object, from a second etchant supply nozzle placed on a second arm. The second arm is substantially symmetrically positioned with respect to the first arm and the second arm has an angle difference of about 180° with respect to the first arm.
申请公布号 US8728338(B2) 申请公布日期 2014.05.20
申请号 US201313887730 申请日期 2013.05.06
申请人 NATIONAL UNIVERSITY CORPORATION OF TOHOKU UNIVERSITY;NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY 发明人 OHMI TADAHIRO;OHASHI TOMOTSUGU;YOSHIKAWA KAZUHIRO;YOSHIDA TETSURO;UCHIMURA TEPPEI;SOEDA KAZUKI
分类号 B44C1/22;C03C15/00;C03C25/68;C23F1/00 主分类号 B44C1/22
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