发明名称 |
Methods for filling a contact hole in a chip package arrangement and chip package arrangements |
摘要 |
In various embodiments, a method for filling a contact hole in a chip package arrangement is provided. The method may include introducing electrically conductive discrete particles into a contact hole of a chip package; and forming an electrical contact between the electrically conductive particles and a contact terminal of the front side and/or the back side of the chip. |
申请公布号 |
US8728873(B2) |
申请公布日期 |
2014.05.20 |
申请号 |
US20100879069 |
申请日期 |
2010.09.10 |
申请人 |
ALLES BENJAMIN;MAHLER JOACHIM;FUERGUT EDWARD;NIKITIN IVAN;INFINEON TECHNOLOGIES AG |
发明人 |
ALLES BENJAMIN;MAHLER JOACHIM;FUERGUT EDWARD;NIKITIN IVAN |
分类号 |
H01L23/52;H01L21/50 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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