| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that an LED is susceptible to overheat leading to an early failure.SOLUTION: The present invention provides improved device, method and system for providing a module-type LED circuit assembly. In particular, an exemplary embodiment according to the present invention includes a module-type LED circuit that can be scaled to various outer shape dimensions. One embodiment of the present invention provides a device for supporting a light emitting diode, comprising an LED circuit board including a first principal plane and a second principal plane. The first principal plane can include a first contact pad and a second contact pad, and the first contact pad and the second contact part are respectively constituted to receive respective connectors from the LED. The second principal plane of the LED circuit board can include a first region, a second region and a third region, and a substrate is mounted to the LED circuit board in the entire third region. |
