| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and a method for attaching a sheet, capable of attaching an adhesive sheet on a thin wall part of an adherend that has an annular projecting part on the outer periphery and has an inside formed as the thin wall part and decoupling the thin wall part from the projecting part.SOLUTION: In a sheet attachment device 10, an adhesive sheet AS is attached on a semiconductor wafer WF in which an annular projecting part WF1 is provided on the outer periphery and a thin wall part WF2 is formed at an inside thereof. The sheet attachment device includes a first pressurizing means 15 relatively disposing the adhesive sheet AS on the upper face of the thin wall part WF2 and pressurizing the thin wall part WF2 on the adhesive sheet AS from the lower face side of the thin wall part WF2. The first pressurizing means deforms the thin wall part WF2 to be decoupled from the projecting part WF1, thereby attaching the adhesive sheet AS on the decoupled thin wall part WF2. |
