| 摘要 |
PROBLEM TO BE SOLVED: To provide a solventless latent, heat-curable polysiloxane composition which realizes a ring-opening polymerization reaction of cyclic polysiloxane in a solventless system and, moreover,having high storage stability; and to provide a method for producing an electronic component using the composition, which has high thermal decomposition resistance.SOLUTION: Provided is a curable polysiloxane composition comprising cyclic polysiloxane, a catalytic amount of tetrabutylammonium difluorotriphenyl silicate (TBAT), and a blocked isocyanate blocked with a hydroxyl group-containing compound in an amount of 0.1 to 3 times th molar amount of the TBAT. Also provided is a method for producing a polysiloxane encapsulated electronic component using the same, obtained by cross-linking and curing only -Si-O- linkages, comprising a process where cyclic polysiloxane is cured by heating to a deblocking temperature of the blocked isocyanate or higher. |
