| 摘要 |
PROBLEM TO BE SOLVED: To provide a stripping solution recycling system using a photoresist stripping solution which strips a photoresist without damaging a copper film upon forming a wiring line or the like by wet etching a copper film or a copper alloy film on a substrate having a large area, and which does not decrease adhesive force between the copper film and a layer to be deposited on the copper film.SOLUTION: A stripping solution composition for a photoresist comprises 1 to 9 mass% of a tertiary alkanol amine, 10 to 70 mass% of a polar solvent, 10 to 40 mass% of water and 10 to 100 ppm of an amino acid. The stripping solution composition suppresses deposition of a resist component on a copper film and does not decrease adhesive force between the copper film and a layer to be deposited. |
