| 摘要 |
The present invention relates to a resin composition for an adhesive containing ethylene-vinylacetate copolymers with optimal physical properties for manufacturing an adhesive with excellent heat-resisting stability while exhibiting excellent physicochemical properties such as adhesiveness, transparency, UV stability and the like. The present invention provides the resin composition for an adhesive containing the ethylene-vinylacetate copolymers. In the ethylene-vinylacetate copolymers, a melting index is 4-500 g/10 minutes, a content of vinylacetate is 15-40 wt%, a molecular weight distribution (MWD) is 3-6, a weigh-average molecular weight (Mw) is 20,000-100,000, a fraction of weight molecular weight of 10,000 or less is 15-30 wt%, and a fraction of weight molecular weight of 100,000 or more is 4-20 wt%. |
