A PACKAGING METHOD OF SILICON PHOTOMULTIPLIER USING PCB PLATE

摘要

The present invention relates to a method of packaging a silicon photomultiplier using a PCB substrate. The method of packaging a silicon photomultiplier using a PCB substrate according to one embodiment of the present invention includes a step of forming at least one array-type silicon photomultiplier on a PCB substrate; a step of attaching a dam PCB to the edge of the PCB substrate and a step of forming a passivation layer in the upper part of the array-type silicon photomultiplier; and a step of cutting the edge region of the PCB substrate which includes the dam PCB attached to the PCB.