发明名称 SUBSTRATE PROCESSING AND ALIGNMENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate efficiently while separating the alignment and the actual processing, by taking out the position information about the position of processing region of a substrate in association with an alignment mark.SOLUTION: A substrate 5 is provided with alignment marks 6a, 6b fixed for the substrate 5, and can be manufactured efficiently by separating the alignment and the actual processing, when the position information about the position of processing region of the substrate 5 is taken out in association with the alignment marks 6a, 6b, before processing the substrate 5. The alignment can be carried out by remeasuring the positions of the alignment marks 6a, 6b only once when processing, and using the position information about the position of processing region thus stored.</p>
申请公布号 JP2014090180(A) 申请公布日期 2014.05.15
申请号 JP20130241304 申请日期 2013.11.21
申请人 THALLNER ERICH 发明人 THALLNER ERICH
分类号 H01L21/027;B29C59/02;G01B7/00;G01B11/00;G03F9/00 主分类号 H01L21/027
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