| 摘要 |
PROBLEM TO BE SOLVED: To provide the structure of a substrate having metal posts for interconnection with a microelectronic element such as a semiconductor chip on the surface, and to provide a manufacturing method therefor.SOLUTION: An interconnection element may have a substrate, e.g., a connection substrate, a package element, a circuit panel, or a microelectronic substrate such as a semiconductor chip. The substrate has a plurality of metal conductive elements, e.g., conductive pads 112, contacts, bonding pads, and traces, exposed to the surface. A plurality of solid metal post 130 may cover the conductive elements, respectively, and project in a direction separating therefrom. An intermetallic layer 121 may be provided between the post and the conductive element. This layer brings conductive interconnection between the post 130 and the conductive element 112. The proximal end of the post adjoining the intermetallic layer is aligned with the intermetallic layer. |
