METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide an insulating resin sheet which is composed of a prepreg to form an insulating layer of a multilayer printed wiring board and does not expose a sheet-shaped fiber substrate contained in the prepreg from the surface of the insulating layer.SOLUTION: An insulating resin sheet includes: a cured prepreg layer obtained by compressing and thermosetting a prepreg where a thermosetting resin composition is impregnated in a sheet-shaped fiber substrate; and thermosetting resin composition layers formed on both surfaces of the cured prepreg layer.