| 摘要 |
PROBLEM TO BE SOLVED: To provide a pretreatment method for selective metallization of the surface of a non-conductive material and a solution used in the method and containing a catalytic metal ion, an acid containing a sulfonate group and chloride ion.SOLUTION: A method for selective metallization includes (a) a step of modifying chemically or physically the surface in a to-be-plated region to prepare the surface of a non-conductive material, (b) a step of bringing the non-conductive material into contact with a pretreatment solution containing a conditioning agent and alkaline substance, (c) a step of bringing the non-conductive material into contact with a catalyst solution containing a catalytic metal ion, an acid having at least one sulfonate group and chloride ion and (d) a step of electroless plating of the to-be-plated region of the surface of the non-conductive material. The conditioning agent is selected from anionic surfactants and organic acids, and the catalyst solution contains 1-50 ppm of a catalytic metal ion, based on the weight of the solution. |
