发明名称 DIELECTRIC CAP LAYER FOR REPLACEMENT GATE WITH SELF-ALIGNED CONTACT
摘要 Embodiments of the present invention provide a method of forming borderless contact for transistors. The method includes forming a sacrificial gate structure embedded in a first dielectric layer, the sacrificial gate structure including a sacrificial gate and a second dielectric layer surrounding a top and sidewalls of the sacrificial gate; removing a portion of the second dielectric layer that is above a top level of the sacrificial gate to create a first opening surrounded directly by the first dielectric layer; removing the sacrificial gate exposed by the removing of the portion of the second dielectric layer to create a second opening surrounded by a remaining portion of the second dielectric layer; filling the second opening with one or more conductive materials to form a gate of a transistor; and filling the first opening with a layer of dielectric material to form a dielectric cap of the gate of the transistor.
申请公布号 US2014134836(A1) 申请公布日期 2014.05.15
申请号 US201213672864 申请日期 2012.11.09
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;GLOBALFOUNDRIES, INC. 发明人 PRANATHARTHIHARAN BALASUBRAMANIAN;SURISETTY CHARAN VEERA VENKATA SATYA;WANG JUNLI;PARK CHANG SEO;XIE RUILONG
分类号 H01L21/283 主分类号 H01L21/283
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