发明名称 |
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE |
摘要 |
A method for fabricating a semiconductor package is disclosed, which includes the steps of: providing a carrier having a release layer and an adhesive layer sequentially formed thereon; disposing a plurality of semiconductor chips on the adhesive layer; forming an encapsulant on the adhesive layer for encapsulating the semiconductor chips; disposing a substrate on the encapsulant; exposing the release layer to light through the carrier so as to remove the release layer and the carrier; and then removing the adhesive layer, thereby effectively preventing the semiconductor chips from being exposed to light so as to avoid any photo damage to the semiconductor chips. |
申请公布号 |
US2014134797(A1) |
申请公布日期 |
2014.05.15 |
申请号 |
US201314013512 |
申请日期 |
2013.08.29 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
CHI CHIEH-YUAN;HUANG JUNG-PANG;CHEN YAN-HENG;HSU HSI-CHANG;CHANG CHIANG-CHENG;CHIU SHIH-KUANG |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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