| 发明名称 |
Semiconductor Device with Copper-Tin Compound on Copper Connector |
| 摘要 |
An embodiment is a method for forming a semiconductor assembly including cleaning a connector including copper formed on a substrate, applying cold tin to the connector, applying hot tin to the connector, and spin rinsing and drying the connector. |
| 申请公布号 |
US2014131863(A1) |
申请公布日期 |
2014.05.15 |
| 申请号 |
US201414157220 |
申请日期 |
2014.01.16 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HWANG CHIEN LING;HSIAO YI-LI;LIU CHUNG-SHI |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
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