发明名称 SUBSTRATE FOR FLEXIBLE DEVICE, FLEXIBLE DEVICE AND METHOD FOR PRODUCING SAME, LAMINATE AND METHOD FOR PRODUCING SAME, AND RESIN COMPOSITION
摘要 <p>The present invention can provide a resin composition, a laminate, a method for producing a laminate, and a method for producing a flexible device, whereby sufficient adhesion is achieved between a resin layer and an inorganic substrate during the course of producing a flexible device, and only the inorganic substrate can be easily peeled off from the resin layer in the final stage. Further, the present invention can provide a substrate for flexible devices and a flexible device using said substrate, wherein variations in film thickness are small and the device is less prone to malfunction when the device is constructed.</p>
申请公布号 WO2014073591(A1) 申请公布日期 2014.05.15
申请号 WO2013JP80080 申请日期 2013.11.07
申请人 ASAHI KASEI E-MATERIALS CORPORATION 发明人 SAITO, YAMATO;IZUMI, AKIHIRO;TAKADA, SHOZO;DOI, ICHIRO
分类号 C08J5/18;B32B17/10;B32B27/34;C08K5/06;C08K5/54;C08L79/08;H01L21/336;H01L29/786 主分类号 C08J5/18
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