| 摘要 |
The method for optimization analysis of bonding positions according to the present invention is a method for optimization analysis of point bonding or continuous bonding used when bonding a plurality of components configuring a structure model comprising planar elements or three dimensional elements, said method comprising: an analysis portion setting step for setting the portion to be analyzed for bonding points or bonding areas where the plurality of components are to be bonded; a fixed bond setting step for setting at least one bonding point or bonding area in the set portion to be analyzed as a fixed bonding point or fixed bonding area; a bonding candidate setting step for setting bonding candidates for bonding points or bonding areas in the portion to be analyzed; an analysis condition setting step for setting analysis conditions for the portion to be analyzed; and an analysis step for determining from among the bonding candidates an optimal bonding point or bonding area that satisfies the analysis condition. |
