LIGHT EMITTING DEVICE AND METHOD OF FABRICATING LIGHT EMITTING DEVICE

摘要

Disclosed are a light emitting device and a fabricating method thereof. The light emitting device (LED) includes a stress control layer having a compressive stress on a substrate; a bonding layer on the stress control layer; a semiconductor layer on the bonding layer and including an active region for emitting light on the bonding layer; a first electrode on a lower surface of the substrate; and a second electrode on the semiconductor layer, wherein the compressive stress of the stress control layer is between about 1 and about 20 GPa.