| 摘要 |
<p>The present invention relates to a multi-component resin system comprising (a) a vinyl ester resin; (b) reactive diluent; (c) a copper compound; and (d) a peroxide, wherein the multi-component resin system further comprises (e) a bidentate ligand X-R-Y in an amount of at least 10 mmol/(kg resin and reactive diluent), whereby X and Y are independently selected from NH2, NHR1 NR1R2, OH and OR3 with the proviso that at least one of the groups X and Y is NH2 or NHR1 R is a C1-C20 alkyl or a C6-C20 aryl; R1 and R2 are independently selected from a C1-C20 alkyl and a polymeric residue; R3 is a C1-C20 alkyl; the multi-component resin system comprises a compound with the following formula R4-Z-C(O)-OO-R5 as peroxide (d), in which Z is not present or is O; R4 is a C1-C20 alkyl or a C6-C20 aryl; R5 is a C4-C20 alkyl or a C(O)R6; whereby R6 is a C1-C20 alkyl or a C6-C20 aryl; the acid value of the primary resin system is lower than 12 mg KOH/g primary resin system; the amount of copper is at least 0.02 mmol Cu/(kg resin and reactive diluent) and at most 1.5 mmol Cu/(kg resin and reactive diluent); the molar ratio between the bidentate ligand X-R-Y and copper is at least 5; and the molar ratio between the bidentate ligand X-R-Y and the peroxide R4-Z-C(O)-OO-R5 is from 0.1 up to and including 10.</p> |
