| 摘要 |
An active matrix substrate (2) is provided with first connecting wirings (64 1 , 64 3 , 64 3 , 64 7 ) connected to gate terminals (51) to which extraction wirings (61 1 , 61 3 , 61 5 , 61 7 ) are connected, second connecting wirings (64 2 , 64 4 , 64 6 ) connected to gate terminals (51) to which extraction wirings (61 2 , 61 4 , 61 6 ) are connected, bundled wirings (65 1 to 65 4 ) each composed of a mutually adjacent first connecting wiring and second connecting wiring bundled together, a first inspection wiring (66) capable of inputting an inspection signal to bundled wirings (66 2 , 65 4 ) that are not adjacent to each other among the bundled wirings, and a second inspection wiring (67) capable of inputting an inspection signal to bundled wirings (65 1 , 65 3 ) that are not adjacent to each other and not connected to the first inspection wiring (66) among the bundled wirings. |
