WAFER LEVEL VACUUM SEALING METHOD USING CONFORMAL DEPOSITION

摘要

Disclosed is a wafer level vacuum sealing method using conformal deposition. The disclosed wafer level vacuum sealing method includes a step of preparing read circuit wafers on which arrays comprising detection devices are arranged; a step of preparing a capping wafer for packing the detection device array in vacuum on the read circuit wafer; a step of bonding the capping wafer on the read circuit wafer; and a step of sealing a via hole which is formed in the capping wafer with a via material by conformal deposition.