发明名称 |
Semiconductor packaging and fabrication method using connecting plate for internal connection |
摘要 |
A semiconductor package with connecting plate for internal connection comprise: a plurality of chips each having a plurality of contact areas on a top surface; one or more connecting plates having a plurality of electrically isolated connecting plate portions each connecting a contact area of the semiconductor chips. The method of making the semiconductor package includes the steps of connecting one or more connecting plates to a plurality of semiconductor chips, applying a molding material to encapsulate the chips and the connecting plates, separating a plurality of connecting plate portions of the connecting plates by shallow cutting through or by grinding. |
申请公布号 |
US8722466(B2) |
申请公布日期 |
2014.05.13 |
申请号 |
US20100722528 |
申请日期 |
2010.03.12 |
申请人 |
LU JUN;LIU KAI;XUE YAN XUN;ALPHA & OMEGA SEMICONDUCTOR, INC. |
发明人 |
LU JUN;LIU KAI;XUE YAN XUN |
分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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