| 摘要 |
The present invention relates to a ultra thin copper foil manufacturing method including: a step (a) of preparing a base film; a step (b) of forming a copper seed layer by directly performing a sputtering deposition process on an upper surface of the base film prepared in the step (a); and a step (c) of completing the copper foil by forming a copper plating layer on an upper surface of the copper seed layer formed in the step (b). The ultra thin copper foil manufacturing method can continuously produce high quality copper foils without damage and tear by making the base film and the copper foil to be easily separated by directly performing a sputtering deposition process on the base film so as to have less adhesion between the base film and the cooper seed layer and can mass-produce copper foils without a separate device or equipment at low costs using the conventional device by producing copper foil on the upper surface of the base film made of relatively cheap PET or PI instead of carrier conventionally used. |
