| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a light-emitting device capable of suppressing a crosstalk amount when sealing a plurality of light-emitting elements packaged with high density with two kinds of sealing resins containing wavelength conversion materials different from each other, and a manufacturing method of the light-emitting device.SOLUTION: An LED light-emitting device (10A) comprises: a substrate (1); a plurality of LED chips (2) packaged on the substrate (1); and a first sealing resin (6) and a second sealing resin (7) containing wavelength conversion materials different from each other to seal the plurality of LED chips (2). The first sealing resin (6) and the second sealing resin (7) seal at least the plurality of LED chips (2), respectively, by being directly brought into contact with the plurality of LED chips (2) different from each other, respectively. At least a contact angle (θ) of the first sealing resin (6) and the substrate (1) is 65° or less.</p> |
