| 摘要 |
The present invention provides a printed circuit board comprising a core insulating layer including an internal circuit pattern on the upper surface or the lower surface; an electronic device which passes through the core insulating layer and has a terminal on the upper part or the lower part, an adhesive layer which covers the terminal; an external insulating layer which covers the internal circuit pattern, the adhesive layer, and the electronic device; and an external circuit pattern which is formed on the upper surface of the external insulating layer, wherein a via which connects the internal circuit pattern and the terminal is formed within the adhesive layer. Therefore, the printed circuit board with a desired thickness regardless of size of the electronic device can be formed by forming the insulating layer regardless of thickness of the electronic device. |
