发明名称 |
SMALL-SIZED POWER SUPPLY MODULE AND SEMICONDUCTOR MODULE |
摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized power generation device and a semiconductor module, capable of reducing thermal deterioration of a secondary battery chip mounted on a small-sized power supply module.SOLUTION: A secondary battery chip having a secondary battery main body part provided on a supporting substrate, and a thermoelectric power generation element are embedded by an embedded resin. A heat shield mechanism having a thermal conductivity lower than that of the embedded resin is provided between a surface contacted with the supporting substrate of the secondary battery main body part and the embedded resin. |
申请公布号 |
JP2014086330(A) |
申请公布日期 |
2014.05.12 |
申请号 |
JP20120235320 |
申请日期 |
2012.10.25 |
申请人 |
FUJITSU LTD |
发明人 |
NAKAGAWA KANAE;SUZUKI TAKASHI |
分类号 |
H01M10/46;H01L35/30;H01M2/10;H01M10/60;H02N11/00 |
主分类号 |
H01M10/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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