发明名称 SMALL-SIZED POWER SUPPLY MODULE AND SEMICONDUCTOR MODULE
摘要 PROBLEM TO BE SOLVED: To provide a small-sized power generation device and a semiconductor module, capable of reducing thermal deterioration of a secondary battery chip mounted on a small-sized power supply module.SOLUTION: A secondary battery chip having a secondary battery main body part provided on a supporting substrate, and a thermoelectric power generation element are embedded by an embedded resin. A heat shield mechanism having a thermal conductivity lower than that of the embedded resin is provided between a surface contacted with the supporting substrate of the secondary battery main body part and the embedded resin.
申请公布号 JP2014086330(A) 申请公布日期 2014.05.12
申请号 JP20120235320 申请日期 2012.10.25
申请人 FUJITSU LTD 发明人 NAKAGAWA KANAE;SUZUKI TAKASHI
分类号 H01M10/46;H01L35/30;H01M2/10;H01M10/60;H02N11/00 主分类号 H01M10/46
代理机构 代理人
主权项
地址
您可能感兴趣的专利