发明名称 ULTRASONIC MEASURING DEVICE, HEAD UNIT, PROBE, AND DIAGNOSTIC SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide an ultrasonic measuring device which can achieve miniaturization of a device, a head unit, a probe, a diagnostic system, etc.SOLUTION: An ultrasonic measuring device includes an ultrasonic transducer device 200 and an integrated circuit device 110. The ultrasonic transducer device 200 includes a board, and an ultrasonic element array arranged on the board. The ultrasonic element array 100 is rectangular. When the long side direction of the rectangle is represented as a first direction D1, the integrated circuit device 110 is mounted on the board so that the long side direction of the integrated circuit device 110 is along the first direction D1. The integrated circuit device 110 has a plurality of transmission circuits TX1-TX64 for outputting a transmission signal to the ultrasonic element array. The plurality of the transmission circuits TX1-TX64 are disposed along the first direction D1.
申请公布号 JP2014083283(A) 申请公布日期 2014.05.12
申请号 JP20120235421 申请日期 2012.10.25
申请人 SEIKO EPSON CORP 发明人 ENDO KATSUMA
分类号 A61B8/00 主分类号 A61B8/00
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