METHOD FOR MANUFACTURING PRINTED BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed board capable of preventing a short circuit between upper and lower wirings and deterioration in insulation resistance.SOLUTION: A method for manufacturing a printed board comprises the steps of: forming an insulating film 7 above an insulating substrate 1; forming a seed layer 11 on the insulating film 7; forming a resist 13 on the seed layer 11; forming wiring grooves 13a to 13e in the resist 13; forming metal wirings 15a to 15e thinner than the resist 13 in the wiring grooves 13a to 13e by electrolytic plating; making the resist 13 thinner than the metal wirings 15a to 15e by etching; removing protrusions t from exposed surfaces of the metal wirings 15a to 15e by polishing; removing the resist 13 by etching; and removing the seed layer 11 exposed from the metal wirings 15a to 15e by etching.