半导体装置及其制造方法,申请号TW096121025-传众专利搜索

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发明名称	半导体装置及其制造方法
摘要
申请公布号	TWI437707	申请公布日期	2014.05.11
申请号	TW096121025	申请日期	2007.06.11
申请人	东芝股份有限公司日本	发明人	木下敦宽;古贺淳二
分类号	H01L29/78;H01L21/336	主分类号	H01L29/78
代理机构		代理人	林志刚台北市中山区南京东路2段125号7楼
主权项
地址	日本

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