| 摘要 |
The present invention relates to a method for manufacturing a printed circuit board and, more particularly, to a method for manufacturing a printed circuit board capable of forming a fine circuit. The present invention includes the steps of: providing a base substrate which includes copper foils laminated on both sides thereof (S1); laminating a photosensitive film on one side of the base substrate and exposing and developing the photosensitive film (S2); adding a penetration prevention plating layer on the exposed part (S3); forming a via hole on the base substrate with the penetration prevention plating layer (S4); forming a first plating layer on both sides of the base substrate including the inside of the via hole (S5); patterning the photosensitive film by laminating and exposing the photosensitive film on the first plating layer (S6); and forming a second plating layer on the first plating layer (S7). |
