发明名称 THE MODULAR CONSTRUCTION KIT OF IMPROVE FOR CIRCUIT ELEMENTS
摘要 <p>The present invention relates to an improved construction kit for module type circuit elements and, more specifically, to an improved construction kit for module type circuit elements comprising individual circuit elements for forming an electronic circuit which are formed in the shape of a module. The respective circuit element block modules are configured to comprise a module case; a circuit diagram of the circuit element; the circuit element; and a circuit element contact unit.</p>
申请公布号 KR20140054614(A) 申请公布日期 2014.05.09
申请号 KR20120120317 申请日期 2012.10.29
申请人 KANG, MIN SOO;PARK, MI HEE 发明人 PARK, MI HEE;KANG, MIN SOO
分类号 G09B23/18;G09B25/02;H05K3/32 主分类号 G09B23/18
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