发明名称 COIL ELEMENT PRODUCTION METHOD
摘要 Provided is a production method for a coil element, whereby a resin mold can be used and the thickness of the coil element can be reduced without peeling away or transfer. The production method for the coil element uses a resin mold capable of being dissolved in an organic solvent, said method having: a step in which the resin mold having an inverse coil element pattern stamped on the surface thereof is prepared; a step in which a metal seed film is formed on the surface of the resin mold; a step in which the metal seed film in an area having no inverse coil element pattern formed therein is removed; a step in which a central conductive film is formed by using a first electroplating and by using the metal seed film as the foundation therefor, said film filling in the area having the inverse coil element pattern stamped therein; and a step in which the resin mold is dissolved and the central conductive film is retrieved.
申请公布号 WO2014068612(A1) 申请公布日期 2014.05.08
申请号 WO2012JP06959 申请日期 2012.10.30
申请人 LEAP CO., LTD;SANO, TAKASHI;TERADA, TOKINORI 发明人 SANO, TAKASHI;TERADA, TOKINORI
分类号 H01F41/04;H01F17/00 主分类号 H01F41/04
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