发明名称 |
COIL ELEMENT PRODUCTION METHOD |
摘要 |
Provided is a production method for a coil element, whereby a resin mold can be used and the thickness of the coil element can be reduced without peeling away or transfer. The production method for the coil element uses a resin mold capable of being dissolved in an organic solvent, said method having: a step in which the resin mold having an inverse coil element pattern stamped on the surface thereof is prepared; a step in which a metal seed film is formed on the surface of the resin mold; a step in which the metal seed film in an area having no inverse coil element pattern formed therein is removed; a step in which a central conductive film is formed by using a first electroplating and by using the metal seed film as the foundation therefor, said film filling in the area having the inverse coil element pattern stamped therein; and a step in which the resin mold is dissolved and the central conductive film is retrieved. |
申请公布号 |
WO2014068612(A1) |
申请公布日期 |
2014.05.08 |
申请号 |
WO2012JP06959 |
申请日期 |
2012.10.30 |
申请人 |
LEAP CO., LTD;SANO, TAKASHI;TERADA, TOKINORI |
发明人 |
SANO, TAKASHI;TERADA, TOKINORI |
分类号 |
H01F41/04;H01F17/00 |
主分类号 |
H01F41/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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