| 摘要 |
A method for testing integrated circuit-to-substrate joints that electrically connect an IC to a substrate. An ammeter is coupled to a test node of the driver IC, while the test node is coupled to a current source, and a measured current output of the ammeter is recorded. A voltmeter is coupled to the test node while the test node is coupled to an end node of a group of dummy IC-to-substrate joints that are daisy chained; a first measured voltage output of the voltmeter is then recorded. The IC then couples the test node to another end node of the daisy chained dummy joints, and a second measured voltage output is recorded. A resistance or admittance value for the electrical connection of the IC to the substrate is then computed, using the first and second measured voltage outputs and the measured current output. Other embodiments are also described and claimed. |
