APPARATUS AND METHOD OF SPUTTERING A TARGET USING A MAGNET UNIT

摘要

Disclosed are an apparatus and a method for sputtering, which reduce the variation of deposited thickness. The sputtering apparatus includes a chamber body; and a target module which is located inside the chamber body and has at least one magnet unit for generating a target and a magnetic field. In here, the magnet unit swings during a sputtering process.