发明名称 Sealed Body and Method for Manufacturing the Same
摘要 A sealed body which is sealed with low-melting-point glass and has high airtightness is provided. In the sealed body, at least a wiring layer is provided between two facing substrates, the two substrates are bonded together with the use of a sealing layer containing glass frits as a material, and a metal layer is selectively provided in a region where the wiring layer and the sealing layer overlap. In a laser light irradiation step, the metal layer functions as a laser light reflecting film and suppresses application of excess energy to a sealing member in a region overlapping with the wiring layer.
申请公布号 US2014125935(A1) 申请公布日期 2014.05.08
申请号 US201314068694 申请日期 2013.10.31
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 NAKAMURA DAIKI;KUBOTA YUSUKE;NISHIDO YUSUKE
分类号 G02F1/1339;H01L33/52 主分类号 G02F1/1339
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