发明名称 PRODUCTION METHOD FOR COIL ELEMENT, COIL ELEMENT ASSEMBLY, AND COIL COMPONENT
摘要 <p>In order to manufacture a coil component without using an insulated substrate, a method for producing a coil element by using a transfer mold is provided, said method having: a step in which a transfer mold having an inverse coil element pattern etched thereon is prepared; a step in which a peel-away film and an insulating film are superimposed and formed upon the surface of the transfer mold; a step in which a resist film is formed on an area having no inverse coil element pattern formed therein upon the insulating film; a step in which the insulating film is removed by etching, using the resist film as a mask; a step in which, after the resist film is removed, the area having the inverse coil element pattern formed therein is filled in, and a central conductive film is formed by a first electroplating, so as to slightly protrude above the insulating film; a step in which the central conductive film is peeled away from the transfer mold; and a step in which a surface conductive film is formed, by a second electroplating and by using the central conductive film as the foundation therefor, and a coil element comprising the central conductive film and the surface conductive film is formed.</p>
申请公布号 WO2014068611(A1) 申请公布日期 2014.05.08
申请号 WO2012JP06958 申请日期 2012.10.30
申请人 LEAP CO., LTD;SANO, TAKASHI;TERADA, TOKINORI 发明人 SANO, TAKASHI;TERADA, TOKINORI
分类号 H01F41/04;H01F17/00 主分类号 H01F41/04
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