发明名称 |
PRODUCTION METHOD FOR COIL ELEMENT, COIL ELEMENT ASSEMBLY, AND COIL COMPONENT |
摘要 |
<p>In order to manufacture a coil component without using an insulated substrate, a method for producing a coil element by using a transfer mold is provided, said method having: a step in which a transfer mold having an inverse coil element pattern etched thereon is prepared; a step in which a peel-away film and an insulating film are superimposed and formed upon the surface of the transfer mold; a step in which a resist film is formed on an area having no inverse coil element pattern formed therein upon the insulating film; a step in which the insulating film is removed by etching, using the resist film as a mask; a step in which, after the resist film is removed, the area having the inverse coil element pattern formed therein is filled in, and a central conductive film is formed by a first electroplating, so as to slightly protrude above the insulating film; a step in which the central conductive film is peeled away from the transfer mold; and a step in which a surface conductive film is formed, by a second electroplating and by using the central conductive film as the foundation therefor, and a coil element comprising the central conductive film and the surface conductive film is formed.</p> |
申请公布号 |
WO2014068611(A1) |
申请公布日期 |
2014.05.08 |
申请号 |
WO2012JP06958 |
申请日期 |
2012.10.30 |
申请人 |
LEAP CO., LTD;SANO, TAKASHI;TERADA, TOKINORI |
发明人 |
SANO, TAKASHI;TERADA, TOKINORI |
分类号 |
H01F41/04;H01F17/00 |
主分类号 |
H01F41/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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