发明名称 CONDUCTIVE PASTE AND DIE BONDING METHOD
摘要 Provided are: a conductive paste that, by means of using silver particles having predetermined crystalline change properties stipulated by means of XRD analysis, can easily control the sinterability of the silver particles in a conductive paste, and by extension after sintering processing, can stably obtain superior thermal conductivity and electrical conductivity; and a die bonding method using the conductive paste. The conductive paste or the like contains: silver particles having a volume average particle size of 0.1 to 30 μm as a sinterable conductive material; and a dispersing medium for resulting in a paste. When the 2&thetas;=38°±0.2° peak integrated intensity in the x-ray diffraction chart obtained by means of XRD analysis prior to sintering the silver particles is S1 and the 2&thetas;=38°±0.2° peak integrated intensity in the x-ray diffraction chart obtained by means of XRD analysis after sintering (at 250°C for 60 minutes) the silver particles is S2, the value of S2/S1 is a value in the range of 0.2-0.8.
申请公布号 WO2014069074(A1) 申请公布日期 2014.05.08
申请号 WO2013JP72132 申请日期 2013.08.20
申请人 KAKEN TECH CO., LTD. 发明人 HORI SHIGEO;FURUI HIROHIKO;FUJITA AKIRA
分类号 H01B1/22;H01B1/00;H01L21/52 主分类号 H01B1/22
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