| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing die-bonding film obtained with a manufacturing method of the dicing die-bonding film capable of manufacturing the dicing die-bonding film which is excellent in adhesivity in a dicing process and in detachability in a pickup process, without design change even in industry scale.SOLUTION: A dicing die-bonding film includes a sticker layer and an adhesive layer which are sequentially laminated on a substrate. The adhesive layer includes an inorganic filler, irregularity is given on a pasting surface with the inorganic filler before pasting to the sticker layer, and an arithmetic average roughness Ra of the pasting surface is 0.015 to 1 μm. An arithmetic average roughness Ra of the sticker layer is ranging from 0.015 to 0.5 μm before pasting to the adhesive layer, a contact area of the pasting surface is ranging from 35 to 90% to a pasting area, and an adhesive strength of the sticker layer is ranging from 0.04 to 0.2 N/10 mm relative to the adhesive layer. |
