| 摘要 |
A method for dividing a thin film device having a first lower electrode layer, a second active layer and a third upper electrode layer, all three layers being continuous over the device, into separate cells which are to be electrically interconnected in series, at least the dividing of the cells being carried out in a single pass of a process head across the device, the process head performing at least the following steps in the single pass: a) making a first cut through the first, second and third layers; b) making a second cut through the second and third layers, the second cut being adjacent to the first cut; c) making a third cut through the third layer, the third cut being adjacent to the second cut and on the opposite side of the second cut to the first cut; wherein at least one of the first and second cuts is formed using two laser beams sequentially during the single pass of the process head across the device, the first laser beam forming a cut through at least one of the layers and the second laser beam forming a cut through at least one other of the layers. |
