| 发明名称 |
HEAT SINK FOR COOLING OF POWER SEMICONDUCTOR MODULES |
| 摘要 |
A heat sink for cooling at least one power semiconductor module, and that includes a basin for containing a cooling liquid. The basin has a contact rim for receiving the base plate and that includes a surface that is sloped inwards to the basin. |
| 申请公布号 |
EP2727143(A1) |
申请公布日期 |
2014.05.07 |
| 申请号 |
EP20120732961 |
申请日期 |
2012.07.02 |
| 申请人 |
VESTAS WIND SYSTEMS A/S |
发明人 |
ABEYASEKERA, TUSITHA;ANDERSEN, THOMAS LUNDGREN;MOELLER, HENRIK B.;STYHM, OVE |
| 分类号 |
H01L23/473;H01L23/373;H01L25/065 |
主分类号 |
H01L23/473 |
| 代理机构 |
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代理人 |
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