COF HEAT BONDING METHOD OF ITO TOUCH SENSOR PANEL

摘要

The present invention relates to a method for thermally bonding a COF on an ITO touchscreen sensor panel. The method for thermally bonding a COF on an ITO touchscreen sensor panel according to the present invention comprises the steps of: attaching an anisotropic conductive film to a printed circuit board; allowing at least one of the ITO touchscreen sensor panel and the printed circuit board to be irradiated with light using an ultraviolet light source; imaging an align mark of the ITO touchscreen sensor panel by the irradiated light; aligning the ITO touchscreen sensor panel with an align mark of the printed circuit board; and compressing the aligned ITO touchscreen sensor panel and the printed circuit board. Accordingly, the accuracy of compression can be enhanced by clearly marking an alignment mark pattern formed on a film-type printed circuit board to which a controller chip capable of driving a touchscreen sensor panel and a touchscreen sensor is attached, and manufacturing costs and a manufacturing time can be reduced by omitting a process of spreading a metal material on the touchscreen sensor panel.