| 摘要 |
A method of forming adhesive packaging is disclosed in which adhesive is applied to select portions of a first substrate, rather than all of the first substrate, in order to bond a second substrate, which may be of a different material, to the first substrate. The method includes the forming a web of laminated foldable substrate using a single automated apparatus which runs a continuous process using a continuous or reel-fed supply of substrate and of laminate film. Also disclosed is an alternate automated apparatus in which adhesive is applied in select portions to a packaging. Also disclosed is an alternate package, with adhesive applied to select portions. Typical non-adhesive treated portions of the first substrate are shown by the hatched areas in fig.4. Use of adhesive on select portions of the first substrate, as opposed to using adhesive across all of the substrate, may present a materials and cost saving advantage. |
