| 摘要 |
A multi-chip package includes a substrate 710 having a surface; a first die 520 attached to the surface of the substrate 710 and a second die 530 attached to the surface of the substrate 710, the first and second dies 710,720 form a die layer 750 of the multi-chip package; and a bridge 740 attached to the first and second dies 710,720 and located between the die layer 750 and the surface of the substrate 710. |
