发明名称 Light emitting diode, light emitting diode package, method of manufacturing light emitting diode and illumination system
摘要 <p>A light emitting diode (100) device according to the embodiment includes a substrate (110); a protective layer (120) on the substrate; an electrode layer (160) on the protective layer; a light emitting structure (145) disposed on the electrode layer to generate light and provided with a first semiconductor layer (130), an active layer (140) under the first semiconductor layer, and a second conductive semiconductor layer (150) under the active layer; and a first electrode (170) having a first end disposed on a top surface of the light emitting structure (145) and a second end disposed on the protective layer (120). The protective layer (120) comes into Schottky contact with at least one of the electrode layer (160) and the first electrode (170). </p>
申请公布号 EP2362450(A3) 申请公布日期 2014.05.07
申请号 EP20110154744 申请日期 2011.02.16
申请人 LG INNOTEK CO., LTD. 发明人 JEONG, HWAN HEE;LEE, SANG YOUL;SONG, JUNE O;CHOI, KWANG KI;MOON, JI HYUNG
分类号 H01L33/38;H01L23/00;H01L33/62 主分类号 H01L33/38
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