| 摘要 |
PROBLEM TO BE SOLVED: To stop film deposition reaction in an extreme short period of time and suppress overshoot. SOLUTION: The film deposition device includes: a first chamber 3 where a substrate 10 is stored; a supply line for supplying a medium, in which a film deposition material is mixed in a supercritical state, onto the first chamber 3; a stage 9 for holding the substrate 10 in the first chamber 3; a second chamber 4 for decompressing the pressure inside the first chamber 3 to lower pressure than the critical pressure of the medium; a pipe 7a for connecting the first chamber 3 and the second chamber 4; and a valve 7b provided in the pipe 7a. COPYRIGHT: (C)2012,JPO&INPIT |
