| 摘要 |
A water removal apparatus (20) removes water contained in a coolant circulating between a target object (11) and a cooling system (14) through a circulation line. The water removal apparatus includes a bypass line (21) through which a part of the coolant separated from the circulation line flows; a heat exchanger (22), provided in the bypass line, for heating the coolant flowing along the bypass line by using a waste heat of the cooling system (14); and a water adsorption material (23), provided at a downstream side of the heat exchanger (22), for adsorbing the water contained in the coolant. Further, an inspection apparatus (10), for performing an inspection for a semiconductor wafer (W) mounted on the target object (11) while controlling a temperature of the semiconductor wafer on the target object, includes the water removal apparatus (20). |
